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Thermal simulation for electronics package

$750-1500 SGD

Cerrado
Publicado hace alrededor de 5 años

$750-1500 SGD

Pagado a la entrega
Looking for someone with good solid background in thermal simulation. We are designing a package for a camera core. The sensor will be integrated with an image processing CMOS ASIC using a PCBA. The assembly will then be house in ceramic base package, capped with a few possible choices of material. We need thermal simulation to be perform on the package based on the selection of material for the housing and also the interface material for heat spreading. The thermal simulation is to determine the best combination that will result in 0 or near 0 thermal gradient of the device across desired working temperature.
ID del proyecto: 19277499

Información sobre el proyecto

20 propuestas
Proyecto remoto
Activo hace 5 años

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20 freelancers están ofertando un promedio de $1.100 SGD por este trabajo
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Hi there, I have designed multiple casings for electronics and have conducted CFD, thermal and stress analysis of the enclosure. The work i have done includes both natural and forced convection. I would like to understand further. Look forward discussing it with you. I can design the optimal thermal solution for your product.
$941 SGD en 1 día
5,0 (45 comentarios)
6,5
6,5
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Hi there So basically you want to create a digital prototype of the behavior of your product. We can help you with that, providing you the simulation and the reports from that simulations, we have make analysis and simulations to PC chassis in the past and we know how to work with materials and optimization. Kind regards DSP Team
$1.500 SGD en 7 días
5,0 (20 comentarios)
6,3
6,3
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Hello I have read the description carefully and carefully, and then what you want. I have a good experiences in engineering optimisation based on thermal simulation. I will provide thermal performance of the package when materials of the housing and interface are changed. I can consider all possibility. I will make the response surface of the thermal performance depending material properties, using DOE like LHS, Monte Carlo or other method. And then, I will get finally optimal combination using Optimisation. I can use a multi-object function for thermal performance. So, you can choose the exact optimal design. I would love to contact for our work. Thank you. Zhang
$1.000 SGD en 4 días
5,0 (25 comentarios)
5,9
5,9
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ibhave great experience in finite element analysis ,i can perform non linear simulations of thermal conditions of camera casing lets discuss details in chat budget is negotiable upon pronlem clarification
$823 SGD en 7 días
4,9 (23 comentarios)
5,3
5,3
Avatar del usuario
I am a professional thermal analysis and test engineer. Thermal management of electronic devices is one of my responsibility as a thermal engineer. I know how to model PCBs, electonic components, solders, etc. I am using CFD and Finite element softwares (usually FE). Besides, I know hot to manage thermal tests of electronic devices. Therefore, I think this job is completely fit for me. I would like to talk the details. Best regard
$833 SGD en 5 días
5,0 (10 comentarios)
4,7
4,7
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Hi. Can u give me more details please. Mechanical Design Engineer # I draw with an engineering approach. # I write a programs for my needs. # SolidWorks # AutoCAD # 3dsMAX # ANSYS # Fusion 360 # FreeCAD # Blender # MS Excel # MS Word # MS Office # C++ # Java 600+ character per minute.
$1.000 SGD en 10 días
5,0 (13 comentarios)
4,4
4,4
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Hi... Experienced in thermal simulation using Ansys. We can discuss more details over chat. Thanks, Navin
$1.111 SGD en 10 días
4,7 (17 comentarios)
4,4
4,4
Avatar del usuario
Am skilled • 3D and 2D Mechanical designs • Solar and wind Energy system design • HVAC design • Design Analysis Using CAD and ANSYS software’s • CFD analysis • Rendering Software skills • Soldwork • Autodesk MEP • Cero PTC • ANSYS • Inventor Beside my full time work at R&D company I have completed the following projects successfully online based on contract agreement 1. Air craft cloud point design 2. Design of folding and unfolding mechanism of 3D-Holograph 3. Thermal and modal Analysis of cabinets 4. Flash light design 5. Knee brace design 6. ICEM CFD expert with VOF and Eulrian Multiphase model of droplet o water With Mr. Ebuka PHD Researcher, China 7. Solar system design projects 8. DCU, and electric Meter thermal Analysis
$750 SGD en 10 días
5,0 (6 comentarios)
3,6
3,6
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Hi there, I would be happy to work on your job immediately. When you would send me something to see what kind of business I could tell you for which time it would be finished. I worked on similar jobs. In my profile you can see some of my work, where you can see very detailed work. I'm an engineer and I'm doing PCB modeling and schematic create and soldering with all elements in for a very long time. I'm a new freelancer beginner, but I have great experience in my field. Send me a quick message and we can figure out if we are a good fit to work together! Kind regards, Petar
$1.333 SGD en 20 días
0,0 (0 comentarios)
0,0
0,0
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I need experiences in: Numerical modeling of a flow of air and heat conductivity in the electrotechnical equipment; Calculation of cooling systems: definition of working points of fans and temperatures of power elements; The solution of problems of the intense deformed state and seismostability of the electrotechnical equipment.
$1.388 SGD en 15 días
0,0 (0 comentarios)
0,0
0,0
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hi I'm expert in ansys and abaqus. I can help u in solving the problem. further I would like to discuss about the project in detail. thank you
$1.222 SGD en 20 días
0,0 (0 comentarios)
0,0
0,0
Avatar del usuario
Thermal analysis of electronic devices, modules, PCB. Heat sink calculation. Mentor FloTHERM and Hyperlynx Thermal.
$1.444 SGD en 30 días
0,0 (0 comentarios)
0,0
0,0

Sobre este cliente

Bandera de SINGAPORE
Singapore, Singapore
5,0
8
Forma de pago verificada
Miembro desde oct 19, 2016

Verificación del cliente

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